Fin Height:
Length:
Power Dissipation @ Temperature Rise:
Product Status:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Width:
Image Part Manufacturer Description Stock Action
HSE-B630-04H CUI Devices
HEAT SINK, EXTRUSION, TO-220, 63
RFQ
6,232
In-stock
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HSE-B20635-035H-W CUI Devices
HEAT SINK, EXTRUSION, TO-220, 63
RFQ
6,360
In-stock
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667-10ABSP Wakefield Thermal
HEATSINK TO-220 W/S/O PINS BLK
RFQ
6,663
In-stock
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HSE-B500-04H CUI Devices
HEAT SINK, EXTRUSION, TO-220, 50
RFQ
6,694
In-stock
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HSE-B508-045H CUI Devices
HEAT SINK, EXTRUSION, TO-220, 50
RFQ
9,156
In-stock
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HSE-B20630-040H CUI Devices
HEAT SINK, EXTRUSION, TO-220, 63
RFQ
5,072
In-stock
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HSE-B20635-035H-01 CUI Devices
HEAT SINK, EXTRUSION, TO-220, 63
RFQ
7,114
In-stock
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HSE-B20635-035H CUI Devices
HEAT SINK, EXTRUSION, TO-220, 63
RFQ
7,330
In-stock
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V5229L ASSMANN WSW Components
HEATSINK ALUM ANOD
RFQ
5,751
In-stock
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HSE-B20508-035H-W CUI Devices
HEAT SINK, EXTRUSION, TO-220, 50
RFQ
5,391
In-stock
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HSE-B20630-040H-01 CUI Devices
HEAT SINK, EXTRUSION, TO-220, 63
RFQ
7,137
In-stock
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HSS-B20-05H CUI Devices
HEATSINK TO-220 9.8W ALUMINUM
RFQ
9,883
In-stock
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HSE-B20381-040H CUI Devices
HEAT SINK, EXTRUSION,TO-220, 38.
RFQ
7,514
In-stock
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532602B00000 BOYD
BOARD LEVEL HEAT SINK
RFQ
7,585
In-stock
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593202B03400G BOYD
BOARD LEVEL HEAT SINK
RFQ
7,673
In-stock
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HSE-B20381-056H CUI Devices
HEAT SINK, EXTRUSION, TO-220, 38
RFQ
6,565
In-stock
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7025BG BOYD
BOARD LEVEL HEAT SINK
RFQ
6,487
In-stock
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PRT-00121 SparkFun
HEATSINK TO-220
RFQ
8,729
In-stock
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HSE-B381-045H CUI Devices
HEAT SINK, EXTRUSION, TO-220, 38
RFQ
8,685
In-stock
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7121DG BOYD
BOARD LEVEL HEAT SINK
RFQ
6,261
In-stock
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