Image Part Manufacturer Description Stock Action
HSB17-404025 CUI Devices
HEAT SINK, BGA, 40 X 40 X 25 MM
RFQ
735
In-stock
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HSE-B635-045H CUI Devices
HEAT SINK, EXTRUSION, TO-220, 63
RFQ
6,778
In-stock
View details Get Quote
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