- Manufacturer：
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- CUI Devices (1)
- Attachment Method：
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- Fin Height：
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- Material：
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- Material Finish：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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12 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
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|
CUI Devices | HEAT SINK, BGA, 17 X 17 X 6 MM |
2,904
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 17MM X 17MM X 14.5MM |
1,104
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 29MM X 29MM X 9.5MM |
523
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK 19X19X14.5MM W/OUT TIM |
377
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 17MM X 17MM X 14.5MM |
925
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 17X17X14.5MM W/OUT TIM |
80
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 29MM X 29MM X 9.5MM |
100
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 19MM X 19MM X 14.5MM |
40
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | SUPERGRIP HEATSINK 29X29X7.5MM |
83
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | SUPERGRIP HEATSINK 17X17X12.5MM |
7,282
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR 25MM BGA |
5,575
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 29X29X9.5MM W/OUT TIM |
7,531
In-stock
|
View details Get Quote |
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