- Manufacturer:
-
- CUI Devices (1)
- Attachment Method:
-
- Material:
-
- Material Finish:
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Natural:
-
7 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 10 X 10 X 7 MM |
1,700
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEAT SINK 19MM X 19MM X 7.5MM |
358
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | SUPERGRIP HEATSINK 19X19X7.5MM |
474
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEAT SINK 19MM X 19MM X 7.5MM |
492
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEAT SINK 25MM X 25MM X 9.5MM |
8,935
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK 19X19X7.5MM W/OUT TIM |
8,422
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK 25X25X9.5MM W/OUT TIM |
6,556
In-stock
|
View details Get Quote |









