- Manufacturer：
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- BOYD (2)
- Attachment Method：
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- Fin Height：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Product Status：
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- Thermal Resistance @ Natural：
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- Type：
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9 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
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|
Wakefield Thermal | HEATSINK CPU 21MM SQ W/DBL TAPE |
9,504
In-stock
|
View details Get Quote | ||
|
|
BOYD | HEATSINK TO-5 1.25W H=.25" BLK |
1,346
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-126 BLACK |
59
In-stock
|
View details Get Quote | ||
|
BOYD | BOARD LEVEL HEAT SINK |
5,673
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR 21MM BGA |
5,702
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR 21MM BGA |
9,305
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR 21MM BGA |
5,812
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 21MM SQ W/DBL TAPE |
8,603
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR 21MM BGA |
9,325
In-stock
|
View details Get Quote |
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