- Manufacturer:
-
- BOYD (10)
- CTS Corporation (1)
- Attachment Method:
-
- Fin Height:
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- Length:
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- Material Finish:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Shape:
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- Thermal Resistance @ Natural:
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- Width:
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38 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEATSINK 27X23MM FRONT PUSH PIN |
99
In-stock
|
View details Get Quote | ||
|
BOYD | HEATSINK TO-220 SOLDERPIN/CLIP |
9,010
In-stock
|
View details Get Quote | ||
|
BOYD | BOARD LEVEL HEAT SINK |
7,522
In-stock
|
View details Get Quote | ||
|
BOYD | BOARD LEVEL HEAT SINK |
6,721
In-stock
|
View details Get Quote | ||
|
BOYD | BOARD LEVEL HEAT SINK |
7,046
In-stock
|
View details Get Quote | ||
|
BOYD | BOARD LEVEL HEAT SINK |
7,463
In-stock
|
View details Get Quote | ||
|
BOYD | BOARD LEVEL HEAT SINK |
8,633
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK 45X45X19.5MM W/OUT TIM |
8,264
In-stock
|
View details Get Quote | ||
|
BOYD | BOARD LEVEL HEAT SINK |
9,920
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK 37.5X37.5X24.5MM NO TIM |
6,823
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK 35MMX35MMX12.5MM W/O TI |
9
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK FOR TO66 |
8,769
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK 27X23MM DIA PUSH PIN |
5,765
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK 23X28MM SIDE PUSH PIN |
8,278
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK 23X28MM FRONT PUSH PIN |
6,033
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK 42.5X42.5X19.5MM NO TIM |
6,327
In-stock
|
View details Get Quote | ||
|
CTS Corporation | HEAT SINK FORGED W/PIN FINS |
6,510
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEAT SINK TI MODULE #TAS5613PHD |
5,002
In-stock
|
View details Get Quote |









