- Manufacturer:
-
- BOYD (1)
- Attachment Method:
-
- Package Cooled:
-
- Power Dissipation @ Temperature Rise:
-
- Product Status:
-
- Thermal Resistance @ Natural:
-
8 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEATSINK CPU 28MM SQBLK W/O TAPE |
8,914
In-stock
|
View details Get Quote | ||
|
BOYD | HEATSINK TO-220 TAB FOLD 42.16MM |
2,836
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK CPU 28MM SQ BLK W/TAPE |
2,214
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK CPU 28MM SQ BLK W/TAPE |
431
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK CPU 28MM SQ BLK W/TAPE |
5,349
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK CPU 28MM SQ BLK W/TAPE |
5,619
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK CPU 28MM SQBLK W/O TAPE |
8,430
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK CPU 28MM SQ BLK W/TAPE |
9,241
In-stock
|
View details Get Quote |









