- Manufacturer:
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- CUI Devices (1)
- Attachment Method:
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- Length:
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- Material:
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- Material Finish:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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8 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 27MM X 27MM X 19.5MM |
328
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEAT SINK 40MM X 40MM X 19.5MM |
813
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEAT SINK 31MM X 31MM X 24.5MM |
812
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, BGA, 35 X 35 X 18 MM |
956
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEAT SINK 61MM X 58.2MM X 6.1MM |
100
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | MAXIFLOW 26.25X26.25X19.5MM T766 |
99
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK 31X31X24.5MM W/OUT TIM |
7,366
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK 40X40X19.5MM W/OUT TIM |
9,738
In-stock
|
View details Get Quote |









