- Manufacturer:
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- CUI Devices (4)
- Attachment Method:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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- Type:
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5 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEATSINK TO-220 4W ALUMINUM |
2,976
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK 31X31X16MM |
32
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEATSINK TO-220 4W ALUMINUM |
44
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEATSINK TO-220 4W ALUMINUM |
98
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEATSINK TO-220 4W ALUMINUM |
5,808
In-stock
|
View details Get Quote |









