- Manufacturer:
-
- Cooling Source (1)
- CUI Devices (1)
- Attachment Method:
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- Diameter:
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- Material Finish:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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6 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEATSINK TO-220 2.9W ALUMINUM |
2,970
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEAT SINK PIN FIN 23X23MM CLIP |
8,505
In-stock
|
View details Get Quote | ||
|
TE Connectivity AMP Connectors | 2 FINS, 2.000 OD HS W/2 LEGS, 23 |
5,482
In-stock
|
View details Get Quote | ||
|
TE Connectivity AMP Connectors | 2 FINS, 2.00 OD HS W/2 LEGS, 21M |
9,642
In-stock
|
View details Get Quote | ||
|
TE Connectivity AMP Connectors | 2 FINS, 2.000 OD HS W/4 LEGS, 25 |
8,303
In-stock
|
View details Get Quote | ||
|
Cooling Source | 25X25 X20MM |
8,006
In-stock
|
View details Get Quote |









