- Manufacturer:
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- CUI Devices (1)
- Attachment Method:
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- Length:
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- Material:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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10 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEATSINK 19X15MM DIA PUSH PIN |
8,318
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 300X45X10MM |
177
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, BGA, 23 X 23 X 10 MM |
5,076
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK 19X15MM FRONT PUSH PIN |
134
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 1220X45X10MM |
14
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK 19X15MM SIDE PUSH PIN |
71
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 BLACK |
6,721
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK 23X12MM FRONT PUSH PIN |
8,271
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK 23X12MM DIA PUSH PIN |
5,630
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK 23X12MM SIDE PUSH PIN |
7,389
In-stock
|
View details Get Quote |









