- Manufacturer：
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- BOYD (1)
- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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7 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
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|
BOYD | HEATSINK BGA 35X35X10MM W/ADH |
1,606
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 30MM X 30MM X 14.5MM |
301
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 27X27X14.5MM W/OUT TIM |
300
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 27MM X 27MM X 14.5MM |
724
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 27MM X 27MM X 14.5MM |
41
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | SUPERGRIP HEATSINK 27X27X12.5MM |
108
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK 30X30X14.5MM W/OUT TIM |
8,834
In-stock
|
View details Get Quote |
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