- Manufacturer:
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- CUI Devices (1)
- Attachment Method:
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- Material:
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- Material Finish:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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10 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 40MM X 30MM X 5MM |
119
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, STAMPING, TO-220, 29. |
1,679
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEAT SINK 27MM X 27MM X 7.5MM |
543
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | SUPERGRIP HEATSINK 27X27X7.5MM |
123
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK 21X12MM SIDE PUSH PIN |
206
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEAT SINK 27MM X 27MM X 7.5MM |
241
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEAT SINK 40MM X 30MM X 5MM |
18
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK 21X12MM DIA PUSH PIN |
9,638
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK 21X12MM FRONT PUSH PIN |
8,537
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK 27X27X7.5MM W/OUT TIM |
8,182
In-stock
|
View details Get Quote |









