- Manufacturer:
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- CUI Devices (1)
- Attachment Method:
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- Material:
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- Material Finish:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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9 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 25MM X 25MM X 14.5MM |
821
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEAT SINK 23MM X 23MM X 14.5MM |
160
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEAT SINK 23MM X 23MM X 14.5MM |
1,533
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 COPPER W/TAB |
7,338
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, STAMPING, TO-218/TO-2 |
2,976
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 COPPER W/TAB |
1,253
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | SUPERGRIP HEATSINK 23X23X12.5MM |
281
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK 25X25X14.5MM W/OUT TIM |
6,461
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK 23X23X14.5MM W/OUT TIM |
7,309
In-stock
|
View details Get Quote |









