- Attachment Method：
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- Material Finish：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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8 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
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|
Ohmite | HEATSINK FOR TO-247 |
331
In-stock
|
View details Get Quote | ||
|
|
BOYD | HEATSINK TO-218 SOLDER PIN |
3,534
In-stock
|
View details Get Quote | ||
|
|
Ohmite | HEATSINK FOR TO-247 |
287
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT SINK |
6,052
In-stock
|
View details Get Quote | ||
|
BOYD | BOARD LEVEL HEAT SINK |
7,044
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT SINK |
7,294
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT SINK |
5,543
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT SINK |
9,365
In-stock
|
View details Get Quote |
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