- Manufacturer:
-
- CUI Devices (1)
- Attachment Method:
-
- Material:
-
- Material Finish:
-
- Package Cooled:
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Natural:
-
7 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 23MM X 23MM X 7.5MM |
1,958
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEAT SINK 17MM X 17MM X 14.5MM |
192
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEAT SINK 23MM X 23MM X 7.5MM |
255
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | MAXIFLOW 16.25X16.25X14.5MM T766 |
99
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK 23X23X7.5MM W/OUT TIM |
10
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | SUPERGRIP HEATSINK 23X23X7.5MM |
3
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, STAMPING, TO-220, 19 |
8,780
In-stock
|
View details Get Quote |









