- Manufacturer：
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- CTS Corporation (2)
- CUI Devices (1)
- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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3 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
.png)
|
CUI Devices | HEAT SINK, BGA, 45 X 45 X 15 MM |
119
In-stock
|
View details Get Quote | ||
|
|
CTS Corporation | HEATSINK FORGED BLK ANO TOP MNT |
6,819
In-stock
|
View details Get Quote | ||
|
|
CTS Corporation | HEATSINK FORGED BLK ANO TOP MNT |
7,805
In-stock
|
View details Get Quote |
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