- Manufacturer：
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- BOYD (1)
- Attachment Method：
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- Fin Height：
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- Length：
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- Material：
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- Material Finish：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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10 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
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|
BOYD | 63730 EXTRUSION 2.25X2.996"X4' |
17
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | 3WX12" EXTRUSION 9099 |
23
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | 3WX36" EXTRUSION 9099 |
22
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK COMPACT |
60
In-stock
|
View details Get Quote | ||
|
|
NTE Electronics, Inc. | HEAT SINK |
5,197
In-stock
|
View details Get Quote | ||
|
|
NTE Electronics, Inc. | HEAT SINK |
48
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR METAL CASE SEMI |
5,757
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK COMPACT |
5,921
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK COMPACT |
5,644
In-stock
|
View details Get Quote | ||
|
|
TE Connectivity AMP Connectors | RETENTION MODULE W/HARDWARE |
5,009
In-stock
|
View details Get Quote |
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