Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Image Part Manufacturer Description Stock Action
V2016B ASSMANN WSW Components
HEATSINK CPU XCUT
RFQ
40,537
In-stock
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HSB01-080808 CUI Devices
HEAT SINK, BGA, 8.5 X 8.5 X 8 MM
RFQ
788
In-stock
View details Get Quote
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