- Manufacturer：
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- BOYD (15)
- Comair Rotron (7)
- CTS Corporation (2)
- CUI Devices (1)
- Attachment Method：
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- Fin Height：
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- Length：
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- Material：
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- Material Finish：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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48 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
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|
BOYD | HEAT SINK TO-220 .500" COMPACT |
17,965
In-stock
|
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|
|
BOYD | HEAT SINK TO-220 .375" COMPACT |
4,936
In-stock
|
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|
|
BOYD | HEATSINK TO-220 W/TAB .375" |
13,833
In-stock
|
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|
|
BOYD | HEATSINK TO-220 CLIP-ON BLACK |
2,813
In-stock
|
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|
|
ASSMANN WSW Components | HEATSINK TO-220 19.05X13.21MM |
3,378
In-stock
|
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|
|
ASSMANN WSW Components | HEATSINK TO-220 19.05X13.21MM |
8,954
In-stock
|
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|
|
Wakefield Thermal | HEATSINK LOW HEIGHT BLK TO-220 |
9,201
In-stock
|
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|
|
Wakefield Thermal | HEATSINK TO-220 LOW HEIGHT BLK |
5,014
In-stock
|
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|
|
BOYD | HEAT SINK TO-220 .250" COMPACT |
847
In-stock
|
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|
|
BOYD | HEATSINK TO-220 TIN CLIP-ON 13MM |
11,222
In-stock
|
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|
|
BOYD | HEATSINK TO-202 LOW PROFILE .5" |
1,031
In-stock
|
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|
|
BOYD | HEATSINK TO-220 .500" COMPACT |
628
In-stock
|
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|
|
BOYD | HEATSINK TO-220 W/TAB .25 |
1,783
In-stock
|
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|
|
BOYD | BOARD LEVEL HEATSINK .515"TO-220 |
1,507
In-stock
|
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|
|
BOYD | BOARD LEVEL HEATSINK .515"TO-220 |
834
In-stock
|
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|
|
ASSMANN WSW Components | HEATSINK ALUM ANOD |
3,925
In-stock
|
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|
|
ASSMANN WSW Components | HEATSINK ALUM ANOD |
7,096
In-stock
|
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|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 BLACK 6-32NUT |
1,598
In-stock
|
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|
|
ASSMANN WSW Components | HEATSINK ALUM ANOD |
1,040
In-stock
|
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|
|
CUI Devices | HEAT SINK, STAMPING, TO-220, 21. |
1,643
In-stock
|
View details Get Quote |
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