- Manufacturer：
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- BOYD (15)
- Comair Rotron (7)
- CTS Corporation (2)
- CUI Devices (1)
- Attachment Method：
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- Length：
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- Material：
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- Material Finish：
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- Package Cooled：
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- Thermal Resistance @ Natural：
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48 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
.png)
|
Comair Rotron | HEATSINK STAMP 9.5X13.2X19.1MM |
6,095
In-stock
|
View details Get Quote | ||
|
|
Comair Rotron | HEATSINK STAMP 9.5X13.2X19.1MM |
5,100
In-stock
|
View details Get Quote | ||
|
|
Comair Rotron | HEATSINK STAMP 13.1X13.2X24MM |
9,323
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK |
6,300
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR TO220 |
8,254
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEAT SINKS BOARD LEVEL PWR SEMI |
5,618
In-stock
|
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|
|
BOYD | BOARD LEVEL HEAT SINK |
9,786
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT SINK |
8,535
In-stock
|
View details Get Quote |
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