- Manufacturer：
-
- BOYD (1)
- Comair Rotron (1)
- CUI Devices (2)
- Attachment Method：
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- Material：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Product Status：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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4 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
.png)
|
BOYD | HEATSINK TO-220 VERT MNT W/TABS |
12,247
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPING, TO-218/TO-2 |
2,400
In-stock
|
View details Get Quote | ||
|
|
Comair Rotron | HEATSINK STAMP 22.2X5.4X30.3MM |
5,098
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 2.9W ALUMINUM |
6,116
In-stock
|
View details Get Quote |
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