- Manufacturer:
-
- BOYD (5)
- Comair Rotron (2)
- CTS Corporation (1)
- CUI Devices (2)
- Attachment Method:
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- Length:
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- Material:
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- Material Finish:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Product Status:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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12 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
BOYD | HEATSINK SMT D-PAK/TO-252 TIN |
10,211
In-stock
|
View details Get Quote | ||
|
BOYD | BOARD LEVEL HEATSINK .375"TO-220 |
5,669
In-stock
|
View details Get Quote | ||
|
BOYD | TOP MOUNT HEATSINK .4" D-PAK |
4,308
In-stock
|
View details Get Quote | ||
|
CTS Corporation | HEATSINK PWR .75"H BLACK TO-220 |
441
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEATSINK TO-220 2.6W ALUMINUM |
56
In-stock
|
View details Get Quote | ||
|
Comair Rotron | HEATSINK STAMP 22.9X8X10.2MM |
9,816
In-stock
|
View details Get Quote | ||
|
Comair Rotron | HEATSINK STAMP 9.5X22.8X17.8MM |
6,743
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK TO-252 COPPER |
7,803
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK ALUM BLACK SMD |
6,676
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK ALUM BLACK SMD |
7,416
In-stock
|
View details Get Quote | ||
|
BOYD | BOARD LEVEL HEAT SINK |
8,346
In-stock
|
View details Get Quote | ||
|
BOYD | BOARD LEVEL HEAT SINK |
6,228
In-stock
|
View details Get Quote |









