Manufacturer:
Attachment Method:
Package Cooled:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Image Part Manufacturer Description Stock Action
579302B00000G BOYD
HEATSINK TO-220 SNAP-DOWN .75"
RFQ
14,291
In-stock
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579402B00000G BOYD
HEATSINK TO-220 SNAP-DOWN .75"
RFQ
4,620
In-stock
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NTE448G NTE Electronics, Inc.
CLIP-ON H/S FOR 40PIN DIP
RFQ
8,035
In-stock
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