- Manufacturer：
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- CUI Devices (2)
- Attachment Method：
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- Material：
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- Material Finish：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Type：
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9 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
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|
ASSMANN WSW Components | HEATSINK ALUM ANOD |
3,135
In-stock
|
View details Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK CPU FORGED |
1,748
In-stock
|
View details Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK CPU FORGED |
881
In-stock
|
View details Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK CPU FORGED |
414
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUSION, TO-218/TO- |
2,387
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUSION, TO-218/TO- |
2,008
In-stock
|
View details Get Quote | ||
|
TE Connectivity AMP Connectors | QSFP SINGLE SAN EXTRUSION HS 6 |
9,798
In-stock
|
View details Get Quote | ||
|
|
TE Connectivity AMP Connectors | GANGED QSFP SAN EXTRUSION HS 6 |
6,932
In-stock
|
View details Get Quote | ||
|
|
TE Connectivity AMP Connectors | QSFP DOUBLE SAN HEATSINK 6.5MM |
5,793
In-stock
|
View details Get Quote |
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