- Manufacturer：
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- BOYD (3)
- CUI Devices (1)
- Attachment Method：
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- Length：
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- Material：
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- Material Finish：
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- Package Cooled：
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- Thermal Resistance @ Natural：
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7 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
.png)
|
ASSMANN WSW Components | HEATSINK ANOD ALUM CPU |
2,804
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 61MM X 58.2MM X 7MM |
355
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 10 X 10 X 7 MM |
1,700
In-stock
|
View details Get Quote | ||
|
|
BOYD | HEATSINK BGA W/ADHESIVE TAPE |
446
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 61MMX58.2MMX7MM |
1
In-stock
|
View details Get Quote | ||
|
BOYD | HEAT SINK |
7,032
In-stock
|
View details Get Quote | ||
|
|
BOYD | HEAT SINK |
8,519
In-stock
|
View details Get Quote |
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