- Manufacturer：
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- BOYD (24)
- Comair Rotron (7)
- CTS Corporation (6)
- CUI Devices (4)
- Attachment Method：
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- Length：
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- Material：
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- Material Finish：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Product Status：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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56 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
.png)
|
Comair Rotron | HEATSINK STAMP 9.5X19X19MM |
5,645
In-stock
|
View details Get Quote | ||
|
|
Comair Rotron | HEATSINK STAMP 9.5X13.2X19.1MM |
6,095
In-stock
|
View details Get Quote | ||
|
|
Comair Rotron | HEATSINK STAMP 9.5X13.2X19.1MM |
5,100
In-stock
|
View details Get Quote | ||
|
Comair Rotron | HEATSINK STAMP 25.9X15X9.5MM |
7,429
In-stock
|
View details Get Quote | ||
|
|
Comair Rotron | HEATSINK STAMP 9.5X22X28MM |
6,734
In-stock
|
View details Get Quote | ||
|
|
Comair Rotron | HEATSINK STAMP 9.5X22.8X17.8MM |
6,743
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT SINK |
7,337
In-stock
|
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|
|
CTS Corporation | HEATSINK DUAL HORZ BLACK TO-220 |
8,272
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK TO-263 COPPER |
5,825
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 3.9W ALUMINUM |
5,671
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT SINK |
9,552
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT SINK |
9,903
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT SINK |
8,346
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT SINK |
6,228
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT SINK |
7,006
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT SINK |
8,535
In-stock
|
View details Get Quote |
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