- Manufacturer:
-
- BOYD (4)
- Comair Rotron (1)
- CUI Devices (1)
- Attachment Method:
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- Length:
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- Material:
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- Material Finish:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Product Status:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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12 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
BOYD | HEATSINK TO-220 VERT MNT W/TAB |
6,997
In-stock
|
View details Get Quote | ||
|
ASSMANN WSW Components | HEAT SINK COPPER DPAK TO-252 |
14,258
In-stock
|
View details Get Quote | ||
|
ASSMANN WSW Components | HEATSINK TO-263 12.70X26.20MM |
12,181
In-stock
|
View details Get Quote | ||
|
BOYD | HEATSINK TO220 VER MNT W/TAB.75" |
8,467
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, STAMPING, TO-220, 12. |
1,781
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 VERT MNT W/TAB |
1,654
In-stock
|
View details Get Quote | ||
|
BOYD | 65715 EXTRUSION 0.39X1"X4' |
124
In-stock
|
View details Get Quote | ||
|
ASSMANN WSW Components | HEATSINK TO-263 12.70X26.20MM |
323
In-stock
|
View details Get Quote | ||
|
ASSMANN WSW Components | HEAT SINK COPPER DPAK TO-252 |
9,850
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 W/TAB BLACK |
7,652
In-stock
|
View details Get Quote | ||
|
BOYD | BGA HEAT SINK |
5,944
In-stock
|
View details Get Quote | ||
|
Comair Rotron | HEATSINK STAMP 26.2X12.7X9.9MM |
9,660
In-stock
|
View details Get Quote |









