- Manufacturer:
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- BOYD (2)
- Attachment Method:
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- Material:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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3 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-263 COPPER |
13,858
In-stock
|
View details Get Quote | ||
|
BOYD | HEATSINK D-PAK3 TIN PLATED SMD |
6,603
In-stock
|
View details Get Quote | ||
|
BOYD | BOARD LEVEL HEAT SINK |
2,184
In-stock
|
View details Get Quote |









