Attachment Method:
Material:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Image Part Manufacturer Description Stock Action
ATS-PCB1074 Advanced Thermal Solutions, Inc.
HEATSINK TO-263 COPPER
RFQ
13,858
In-stock
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573400D00010G BOYD
HEATSINK D-PAK3 TIN PLATED SMD
RFQ
6,603
In-stock
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573400D00000G BOYD
BOARD LEVEL HEAT SINK
RFQ
2,184
In-stock
View details Get Quote
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