- Manufacturer：
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- CUI Devices (1)
- Sarnikon (6)
- Attachment Method：
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- Length：
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- Material：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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9 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
.png)
|
CUI Devices | HEAT SINK, BGA, 17 X 17 X 11.5 M |
3,576
In-stock
|
View details Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK ANOD ALUM SOT-32 |
914
In-stock
|
View details Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK ALUM ANOD |
8,148
In-stock
|
View details Get Quote | ||
|
|
Sarnikon | EXTRUDED HEATSINK 29X35MM |
500
In-stock
|
View details Get Quote | ||
|
|
Sarnikon | EXTRUDED HEATSINK 29X30MM |
500
In-stock
|
View details Get Quote | ||
|
|
Sarnikon | EXTRUDED HEATSINK 29X25MM |
500
In-stock
|
View details Get Quote | ||
|
|
Sarnikon | EXTRUDED HEATSINK 29X50MM |
500
In-stock
|
View details Get Quote | ||
|
|
Sarnikon | EXTRUDED HEATSINK 29X45MM |
500
In-stock
|
View details Get Quote | ||
|
|
Sarnikon | EXTRUDED HEATSINK 29X40MM |
500
In-stock
|
View details Get Quote |
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