- Manufacturer：
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- BOYD (1)
- iBASE Technology (1)
- iWave Systems (2)
- Malico (1)
- Sarnikon (6)
- Attachment Method：
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- Length：
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- Material：
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- Material Finish：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Shape：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Width：
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33 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
.png)
|
ASSMANN WSW Components | HEATSINK CPU W/ADHESIVE STAMPED |
5,761
In-stock
|
View details Get Quote | ||
|
BOYD | BOARD LEVEL HEAT SINK |
6,863
In-stock
|
View details Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK CPU W/ADHESIVE STAMPED |
7,581
In-stock
|
View details Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK CPU STAMPED |
5,551
In-stock
|
View details Get Quote | ||
|
|
Sarnikon | EXTRUDED HEATSINK 27X50MM |
500
In-stock
|
View details Get Quote | ||
|
|
Sarnikon | EXTRUDED HEATSINK 27X45MM |
500
In-stock
|
View details Get Quote | ||
|
|
Sarnikon | EXTRUDED HEATSINK 27X40MM |
500
In-stock
|
View details Get Quote | ||
|
|
Sarnikon | EXTRUDED HEATSINK 27X35MM |
500
In-stock
|
View details Get Quote | ||
|
|
Sarnikon | EXTRUDED HEATSINK 27X30MM |
500
In-stock
|
View details Get Quote | ||
|
|
Sarnikon | EXTRUDED HEATSINK 27X25MM |
500
In-stock
|
View details Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK CPU STAMPED |
5,986
In-stock
|
View details Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK ALUM ANOD |
5,210
In-stock
|
View details Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK ALUM ANOD |
7,181
In-stock
|
View details Get Quote |
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