- Manufacturer：
-
- BOYD (4)
- Comair Rotron (1)
- CUI Devices (1)
- Attachment Method：
-
- Material：
-
- Power Dissipation @ Temperature Rise：
-
- Product Status：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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7 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
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|
BOYD | HEATSINK TO-220 TIN CLIP-ON 13MM |
11,222
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEATSINK .515"TO-220 |
1,507
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEATSINK .515"TO-220 |
834
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPING, TO-220, 21. |
1,643
In-stock
|
View details Get Quote | ||
|
|
BOYD | HEATSINK TO-220 TIN CLIP-ON 21MM |
5,550
In-stock
|
View details Get Quote | ||
|
|
Comair Rotron | HEATSINK STAMP 13.1X13.2X24MM |
9,323
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK |
6,300
In-stock
|
View details Get Quote |
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