- Attachment Method：
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- Length：
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- Material：
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- Material Finish：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Shape：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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8 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
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|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 300X27.5X13.5 |
2,607
In-stock
|
View details Get Quote | ||
|
|
EDATEC | HEATSINK Raspberry Pi CM4 |
344
In-stock
|
View details Get Quote | ||
|
|
EDATEC | HEATSINK Raspberry Pi CM4 |
238
In-stock
|
View details Get Quote | ||
|
|
BOYD | COPPER HEATSINK 40X40.5X13.5MM |
55
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 1220X27.5X13.5MM |
8
In-stock
|
View details Get Quote | ||
|
BOYD | BOARD LEVEL HEAT SINK |
33
In-stock
|
View details Get Quote | ||
|
|
NTE Electronics, Inc. | HEAT SINK-TO-5 TRANS 3.0W |
12
In-stock
|
View details Get Quote | ||
|
|
TE Connectivity AMP Connectors | GANGED QSFP LAN EXTRUSION HS 1 |
9,203
In-stock
|
View details Get Quote |
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