- Manufacturer:
-
- BOYD (4)
- CUI Devices (3)
- iBASE Technology (1)
- Malico (1)
- Sarnikon (4)
- Attachment Method:
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- Length:
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- Material:
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- Material Finish:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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- Type:
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- Width:
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49 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
ASSMANN WSW Components | HEATSINK CPU STAMPED |
5,735
In-stock
|
View details Get Quote | ||
|
BOYD | COPPER HEATSINK 70X69X14MM |
8,391
In-stock
|
View details Get Quote | ||
|
BOYD | COPPER HEATSINK 50X50X14MM |
9,085
In-stock
|
View details Get Quote | ||
|
BOYD | COPPER HEATSINK 60X60X14MM |
5,707
In-stock
|
View details Get Quote | ||
|
BOYD | COPPER HEATSINK 38.5X37.6X14MM |
7,423
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | COPPER HEATSINK 70X70X14MM |
7,646
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | ALUMINUM HEATSINK 38.5X37.6X14MM |
9,383
In-stock
|
View details Get Quote | ||
|
Sarnikon | EXTRUDED HEATSINK 47X50MM |
10
In-stock
|
View details Get Quote | ||
|
ASSMANN WSW Components | FINGER-SHAPED-HEATSINK 8K/W |
7,914
In-stock
|
View details Get Quote |









