- Manufacturer：
-
- BOYD (1)
- Attachment Method：
-
- Material：
-
- Material Finish：
-
- Package Cooled：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
4 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
.png)
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 BLACK |
446
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 300X13.9X25MM |
6
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 1220X13.9X25MM |
4
In-stock
|
View details Get Quote | ||
|
BOYD | INTEL XEON CPU COOLER 1U |
7,389
In-stock
|
View details Get Quote |
Copyright © 2009-2024 lianyixinic.com . All Rights Reserved.