- Manufacturer:
-
- CUI Devices (5)
- Attachment Method:
-
- Material:
-
- Material Finish:
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- Package Cooled:
-
- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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8 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 300X80X30MM |
163
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEATSINK TO-220 5.1W ALUMINUM |
3,267
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEATSINK TO-220 4.7W ALUMINUM |
3,946
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEATSINK TO-220 4.6W ALUMINUM |
2,808
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEATSINK TO-220 5.1W ALUMINUM |
378
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEATSINK TO-220 4.7W ALUMINUM |
708
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 1220X80.3X29.97M |
7,121
In-stock
|
View details Get Quote | ||
|
TE Connectivity AMP Connectors | RETENTION MODULE W/HARDWARE |
5,009
In-stock
|
View details Get Quote |









