- Manufacturer:
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- BOYD (2)
- Sanyo Denki (1)
- Attachment Method:
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- Length:
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- Material:
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- Material Finish:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Product Status:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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7 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 56MM X 56MM X 31MM |
122
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-3 BLACK |
168
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | 10.827WX12" EXTRUSION 19572 |
16
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | 10.827WX36" EXTRUSION 19572 |
5
In-stock
|
View details Get Quote | ||
|
Sanyo Denki | P3, 800MHZ, FC-PGA |
6,364
In-stock
|
View details Get Quote | ||
|
BOYD | BOARD LEVEL HEAT SINK |
9,358
In-stock
|
View details Get Quote | ||
|
BOYD | BOARD LEVEL HEAT SINK |
9,545
In-stock
|
View details Get Quote |









