- Manufacturer：
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- BOYD (12)
- CTS Corporation (2)
- CUI Devices (1)
- Wakefield Thermal (17)
- Attachment Method：
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- Length：
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- Material：
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- Material Finish：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Product Status：
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- Shape：
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- Thermal Resistance @ Natural：
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- Type：
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35 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
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|
BOYD | HEAT SINK BRIDGE RECT 31.75MM |
9,662
In-stock
|
View details Get Quote | ||
|
|
NTE Electronics, Inc. | HEAT SINK |
48
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK TO-220 OMNIDIRECT BLK |
5,836
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT SINK |
6,948
In-stock
|
View details Get Quote | ||
|
|
BOYD | HEAT SINK |
7,015
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK POWER TO-3 |
6,222
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK POWER TO-3 |
6,493
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK POWER TO-3 |
5,167
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK POWER TO-3 |
9,961
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK TO-220 OMNIDIRECT BLK |
9,030
In-stock
|
View details Get Quote | ||
|
|
CTS Corporation | HEATSINK PWR 1.25"H BLACK TO-3 |
7,040
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 2.9W ALUMINUM |
6,116
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT SINK |
7,174
In-stock
|
View details Get Quote | ||
|
|
BOYD | HEAT SINK 12W 1.25"H SPACE SAVER |
22
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT SINK |
9,445
In-stock
|
View details Get Quote |
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