- Manufacturer：
-
- CUI Devices (2)
- Attachment Method：
-
- Material：
-
- Material Finish：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
4 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
.png)
|
Advanced Thermal Solutions, Inc. | EXTRUSION 300X51.6X42.5MM |
37
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | PCIE EXTRUSION PROFILE, AL6063 |
9
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 7.4W ALUMINUM |
6,772
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPING, TO-218/TO-2 |
8,066
In-stock
|
View details Get Quote |
Copyright © 2009-2024 lianyixinic.com . All Rights Reserved.