- Manufacturer:
-
- Panasonic (1)
- AMEC Thermasol (7)
- BOYD (46)
- Cooling Source (17)
- CTS Corporation (113)
- CUI Devices (13)
- Enclustra (7)
- iBASE Technology (46)
- iWave Systems (9)
- Malico (34)
- Molex (4)
- Ohmite (4)
- Radian (1)
- Sanyo Denki (13)
- Seeed (2)
- SparkFun (1)
- T-Global Technology (67)
- Trenz Electronic (1)
- Vicor (20)
- Wakefield Thermal (11)
- Diameter:
-
- Fin Height:
-
- Length:
-
- Material:
-
- Material Finish:
-
- Package Cooled:
-
- Power Dissipation @ Temperature Rise:
-
- Product Status:
-
- Shape:
-
- Thermal Resistance @ Forced Air Flow:
-
- Thermal Resistance @ Natural:
-
- Type:
-
- Width:
-
- Filter:
551 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
T-Global Technology | CERAMIC HEAT SPREADER 30X30MM GR |
10
In-stock
|
View details Get Quote | ||
|
T-Global Technology | XL25 CERAMIC BOARD 20X20X2MM |
86
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEATSINK TO-220 3.6W ALUMINUM |
7,621
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | LOW PROFILE TWISTED FIN HEAT SIN |
8,153
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEATSINK TO-220 3.6W ALUMINUM |
8,841
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEATSINK TO-220 4.1W ALUMINUM |
6,894
In-stock
|
View details Get Quote | ||
|
BOYD | HEATSINK |
6,237
In-stock
|
View details Get Quote | ||
|
BOYD | HEATSINK |
9,745
In-stock
|
View details Get Quote | ||
|
BOYD | HEATSINK |
9,703
In-stock
|
View details Get Quote | ||
|
TE Connectivity AMP Connectors | HTS795-1=HS UPLTD |
8,767
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEAT SINK FOR TI MODULE # |
5,096
In-stock
|
View details Get Quote |









