- Manufacturer：
-
- BOYD (22)
- CUI Devices (26)
- Seeed (6)
- T-Global Technology (23)
- Wakefield Thermal (218)
- Fin Height：
-
- Length：
-
- Material Finish：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Product Status：
-
- Shape：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Type：
-
- Width：
-
401 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
.png)
|
Wakefield Thermal | HEATSINK FOR PWR MOD/IGBT/RELAY |
34
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 300X200X32MM |
19
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 300X201X45MM |
8
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 300X342X49.5MM |
10
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 1220X100.38X20MM |
2
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK 12X19" EXTRUSION |
10
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 1220X93.4X40MM |
10
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | 11.811WX36" EXTRUSION 19740 |
10
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 1220X342X49.5MM |
4
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | PCIE EXTRUSION PROFILE, AL6063 |
68
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA,25 X 25 X 10 MM |
617
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 18 X 18 X 10 MM |
302
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 33.5 X 33.5 X 8 |
937
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 30.7 X 30.7 X 14 |
409
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 23 X 23 X 25 MM |
886
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 35 X 35 X 18 MM |
956
In-stock
|
View details Get Quote | ||
|
|
BOYD | 63730 EXTRUSION 2.25X2.996"X4' |
17
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 27 X 27 X 18 MM |
631
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 300X15X6MM |
100
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | 1.625WX12" EXTRUSIO 16079 XX2014 |
90
In-stock
|
View details Get Quote |
Copyright © 2009-2024 lianyixinic.com . All Rights Reserved.