Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Image Part Manufacturer Description Stock Action
HSB01-080808 CUI Devices
HEAT SINK, BGA, 8.5 X 8.5 X 8 MM
RFQ
788
In-stock
View details Get Quote
ATS014014016-PF-3O Advanced Thermal Solutions, Inc.
HEAT SINK 14MM X 14MM X 16MM
RFQ
88
In-stock
View details Get Quote
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