- Manufacturer:
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- CUI Devices (1)
- Fin Height:
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- Material:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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2 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 8.5 X 8.5 X 8 MM |
788
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEAT SINK 14MM X 14MM X 16MM |
88
In-stock
|
View details Get Quote |









