Fin Height:
Length:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Width:
Image Part Manufacturer Description Stock Action
133-4.5B Wakefield Thermal
HEATSINK EXTRUDED
RFQ
5,646
In-stock
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133-11G9 Wakefield Thermal
HEATSINK EXTRUDED
RFQ
5,279
In-stock
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133-11B9 Wakefield Thermal
HEATSINK EXTRUDED
RFQ
6,629
In-stock
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133-10G Wakefield Thermal
HEATSINK EXTRUDED
RFQ
6,186
In-stock
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133-10B Wakefield Thermal
HEATSINK EXTRUDED
RFQ
7,880
In-stock
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132-5B9 Wakefield Thermal
HEATSINK EXTRUDED
RFQ
8,725
In-stock
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132-4.5G Wakefield Thermal
HEATSINK EXTRUDED
RFQ
6,434
In-stock
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132-4.5B Wakefield Thermal
HEATSINK EXTRUDED
RFQ
7,059
In-stock
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132-15.5G Wakefield Thermal
HEATSINK EXTRUDED
RFQ
6,966
In-stock
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132-15.5B Wakefield Thermal
HEATSINK EXTRUDED
RFQ
7,811
In-stock
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132-11G9 Wakefield Thermal
HEATSINK EXTRUDED
RFQ
6,827
In-stock
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132-11B9 Wakefield Thermal
HEATSINK EXTRUDED
RFQ
9,655
In-stock
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132-10G Wakefield Thermal
HEATSINK EXTRUDED
RFQ
6,292
In-stock
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132-10B Wakefield Thermal
HEATSINK EXTRUDED
RFQ
6,656
In-stock
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2-1542009-7 TE Connectivity AMP Connectors
RETENTION MODULE W/HARDWARE
RFQ
5,009
In-stock
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AH00119V02750CE Ohmite
HEATSINK, FLAT BACK 2.75"
RFQ
399
In-stock
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IW-FSKALU-CLASLR-CU03 iWave Systems
ZU+ ZU19/17/11 MPSOC SOM FANSINK
RFQ
9
In-stock
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IW-FSKALU-CLASLR-CU01 iWave Systems
ARRIA10 SOC SOM FANSINK
RFQ
10
In-stock
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IW-FSKALU-CLASLR-CU02 iWave Systems
ZU+ZU7/ZU5/ZU4 MPSOC SOM FANSINK
RFQ
10
In-stock
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AH80126V02000NE Ohmite
EXTR FLAT BACK 2" UNFINISHED
RFQ
3
In-stock
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