- Manufacturer：
-
- BOYD (109)
- Comair Rotron (24)
- CTS Corporation (27)
- CUI Devices (58)
- Ohmite (16)
- Wakefield Thermal (77)
- Fin Height：
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- Length：
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- Material：
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- Material Finish：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Product Status：
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- Shape：
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- Thermal Resistance @ Natural：
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375 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
.png)
|
Comair Rotron | HEATSINK STAMP 25.4X12.7X30MM |
8,569
In-stock
|
View details Get Quote | ||
|
|
Comair Rotron | HEATSINK STAMP 24.1X48.3X23.6 |
6,756
In-stock
|
View details Get Quote | ||
|
|
Comair Rotron | HEATSINK EXTRUDED 25X41.6X38.1MM |
7,890
In-stock
|
View details Get Quote | ||
|
Comair Rotron | HEATSINK EXTRUDED 25X41.6X38.1MM |
7,603
In-stock
|
View details Get Quote | ||
|
|
Comair Rotron | HEATSINK EXTRUDED 25X41.6X50.8MM |
9,391
In-stock
|
View details Get Quote | ||
|
|
Comair Rotron | HEATSINK EXTRUD 12.7X34.9X38.1MM |
5,366
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR TO218/TO220 |
7,838
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUSION, TO-218, 38 |
9,790
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK TO-220 W/S/O PINS BLK |
5,867
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT SINK |
8,082
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUSION, TO-220, 63 |
6,232
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUSION, TO-218, 25 |
5,285
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUSION, TO-218, 38 |
6,736
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK TO-220 W/PINS BLK 2" |
5,215
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUSION,TO-218, 63. |
5,496
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR TO218/TO220 |
9,993
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT SINK |
5,543
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUSION, TO-220, 63 |
6,360
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUSION, TO-218, 31 |
5,682
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK TO-220 W/S/O PINS BLK |
6,663
In-stock
|
View details Get Quote |
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