- Manufacturer：
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- BOYD (10)
- Comair Rotron (4)
- Fin Height：
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- Length：
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- Material：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Product Status：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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26 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
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|
BOYD | HEATSINK D2PAK .4" HIGH SMD |
19,633
In-stock
|
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|
|
BOYD | HEATSINK SMT D-PAK/TO-252 TIN |
10,211
In-stock
|
View details Get Quote | ||
|
|
BOYD | TOP MOUNT HEATSINK .45" D2PAK |
15,890
In-stock
|
View details Get Quote | ||
|
|
BOYD | HEATSINK TO-263 (D2PK) |
9,392
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEATSINK .375" D2PAK |
14,005
In-stock
|
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|
|
ASSMANN WSW Components | HEAT SINK COPPER DPAK TO-252 |
14,258
In-stock
|
View details Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK TO-263 12.70X26.20MM |
12,181
In-stock
|
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|
|
Wakefield Thermal | HEATSINK DPAK SMT TIN PLATED |
15,909
In-stock
|
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|
|
BOYD | HEATSINK D-PAK3 TIN PLATED SMD |
6,603
In-stock
|
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|
|
ASSMANN WSW Components | HEATSINK TO-263 19.38X25.40MM |
10,683
In-stock
|
View details Get Quote | ||
|
|
BOYD | TOP MOUNT HEATSINK .4" D-PAK |
4,308
In-stock
|
View details Get Quote | ||
|
|
BOYD | TOP MOUNT HEATSINK .4" D2PAK |
721
In-stock
|
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|
|
BOYD | BOARD LEVEL HEAT SINK |
2,184
In-stock
|
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|
Wakefield Thermal | BOARD LEVEL HEAT SINKS |
155
In-stock
|
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|
|
ASSMANN WSW Components | HEATSINK TO-263 12.70X26.20MM |
323
In-stock
|
View details Get Quote | ||
|
|
ASSMANN WSW Components | HEAT SINK COPPER DPAK TO-252 |
9,850
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEATSINK .375" D2PAK |
5,407
In-stock
|
View details Get Quote | ||
|
|
Comair Rotron | HEATSINK STAMP 26.2X12.7X9.9MM |
9,660
In-stock
|
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|
|
Comair Rotron | HEATSINK STAMP 22.9X8X10.2MM |
9,816
In-stock
|
View details Get Quote | ||
|
|
Comair Rotron | HEATSINK STAMP 25.9X15X9.5MM |
7,429
In-stock
|
View details Get Quote |
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