- Fin Height:
-
- Package Cooled:
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Forced Air Flow:
-
- Thermal Resistance @ Natural:
-
- Type:
-
2 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
BOYD | BGA HEAT SINK |
3,616
In-stock
|
View details Get Quote | ||
|
BOYD | HEATSINK BGA W/O SOLDER ANCHORS |
870
In-stock
|
View details Get Quote |









