- Manufacturer：
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- BOYD (2)
- Comair Rotron (1)
- CUI Devices (1)
- Attachment Method：
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- Material：
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- Power Dissipation @ Temperature Rise：
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- Product Status：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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5 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
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|
BOYD | HEATSINK SMT D-PAK/TO-252 TIN |
10,211
In-stock
|
View details Get Quote | ||
|
|
BOYD | TOP MOUNT HEATSINK .4" D-PAK |
4,308
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-252 D-PAK COPPER |
307
In-stock
|
View details Get Quote | ||
|
Comair Rotron | HEATSINK STAMP 22.9X8X10.2MM |
9,816
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK TO-252 COPPER |
7,803
In-stock
|
View details Get Quote |
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