- Manufacturer：
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- Adafruit (1)
- CUI Devices (1)
- Attachment Method：
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- Material Finish：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Type：
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4 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
.png)
|
CUI Devices | HEATSINK TO-220 2.9W ALUMINUM |
2,970
In-stock
|
View details Get Quote | ||
|
|
T-Global Technology | ALUMINIUM HEAT SINK 13X13MM |
208
In-stock
|
View details Get Quote | ||
|
|
T-Global Technology | ALUMINIUM HEAT SINK 13X13MM |
222
In-stock
|
View details Get Quote | ||
|
|
Adafruit | MINI ALUMINUM HEAT SINK FOR RASP |
851
In-stock
|
View details Get Quote |
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