- Manufacturer：
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- Cooling Source (1)
- CUI Devices (4)
- Malico (2)
- Ohmite (1)
- Attachment Method：
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- Material：
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- Material Finish：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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