- Manufacturer：
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- BOYD (7)
- Comair Rotron (3)
- CTS Corporation (2)
- CUI Devices (2)
- Attachment Method：
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- Fin Height：
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- Material：
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- Material Finish：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Product Status：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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19 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
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|
BOYD | HEATSINK TO-220 CLIP-ON BLACK |
2,813
In-stock
|
View details Get Quote | ||
|
|
BOYD | HEATSINK TO-220 BLK |
1,737
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK TO-220 SM FOOTPRINT BLK |
1,938
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK TO-220 TOP MNT BLK |
23,621
In-stock
|
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|
|
BOYD | HEATSINK TO-220 EXT CAP 2W |
19,931
In-stock
|
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|
|
BOYD | BOARD LEVEL HEATSINK .375"TO-220 |
5,669
In-stock
|
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|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 BLACK |
1,721
In-stock
|
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|
|
ASSMANN WSW Components | HEATSINK TO-220 17.78X44.45MM |
444
In-stock
|
View details Get Quote | ||
|
CTS Corporation | HEATSINK VERT .85"H BLACK TO-220 |
5,134
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 BLACK |
9,333
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT SINK |
5,123
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT SINK |
9,280
In-stock
|
View details Get Quote | ||
|
|
Comair Rotron | HEATSINK STAMP 17.8X44.5X9.5MM |
5,376
In-stock
|
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|
|
Comair Rotron | HEATSINK STAMP 17.8X44.5X12.7MM |
7,495
In-stock
|
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|
|
Comair Rotron | HEATSINK STAMP 9.5X22.8X17.8MM |
6,743
In-stock
|
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|
|
CTS Corporation | HEATSINK PRESS ON .25"H BLK TO-5 |
9,256
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 3.9W ALUMINUM |
5,671
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 4.4W ALUMINUM |
5,857
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT SINK |
8,346
In-stock
|
View details Get Quote |
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